Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.02in Thick, 5W/m·K, Silicone, 16 x 8 x 0.02in
- RS庫存編號:
- 282-6829
- 製造零件編號:
- GAP PAD TGP HC5000, 16in x 8in x 0.02 sh
- 製造商:
- Bergquist
當前暫無庫存，可於11/07/2024發貨，6 工作日送達。
已增加
單價（不含稅） 個
TWD5,465.00
(不含稅)
TWD5,738.25
(含稅)
| 單位 | Per unit |
| 1 + | TWD5,465.00 |
- RS庫存編號:
- 282-6829
- 製造零件編號:
- GAP PAD TGP HC5000, 16in x 8in x 0.02 sh
- 製造商:
- Bergquist
法例與合規
不適用
- COO (Country of Origin):
- US
產品詳細資訊
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance low compression stress
Fiberglass reinforced for shear and tear resistance
Fiberglass reinforced for shear and tear resistance
規格
屬性 | 值 |
|---|---|
| Dimensions | 16 x 8 x 0.02in |
| Thickness | 0.02in |
| Length | 16in |
| Width | 8in |
| Thermal Conductivity | 5W/m·K |
| Material | Silicone |
| Self-Adhesive | Yes |
| Series | HC5000 |