Bergquist 2200SF Series Self-Adhesive Thermal Gap Pad, 0.04in Thick, 2W/m·K, TIM, 16 x 8 x 0.04in
- RS庫存編號:
- 282-6751
- 製造零件編號:
- GAP PAD TGP 2200SF, 16in x 8in x 0.04 sh
- 製造商:
- Bergquist
當前暫無庫存，可於11/07/2024發貨，6 工作日送達。
已增加
單價（不含稅） 個
TWD3,844.00
(不含稅)
TWD4,036.20
(含稅)
| 單位 | Per unit |
| 1 + | TWD3,844.00 |
- RS庫存編號:
- 282-6751
- 製造零件編號:
- GAP PAD TGP 2200SF, 16in x 8in x 0.04 sh
- 製造商:
- Bergquist
法例與合規
不適用
- COO (Country of Origin):
- US
產品詳細資訊
The Bergquist Silicone-Free Formulation, High Performance Thermally Conductive Material. It is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The compound is silicone free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
規格
屬性 | 值 |
|---|---|
| Dimensions | 16 x 8 x 0.04in |
| Thickness | 0.04in |
| Length | 16in |
| Width | 8in |
| Thermal Conductivity | 2W/m·K |
| Material | TIM |
| Self-Adhesive | Yes |
| Series | 2200SF |