Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.02in Thick, 2W/m·K, Silicone, 16 x 8 x 0.02in
- RS庫存編號:
- 282-6743
- 製造零件編號:
- GAP PAD TGP 2000, 16in x 8in x 0.02 sh
- 製造商:
- Bergquist
當前暫無庫存,可於11/07/2024發貨,6 工作日送達。
已增加
單價(不含稅) 個
TWD5,267.00
(不含稅)
TWD5,530.35
(含稅)
單位 | Per unit |
1 + | TWD5,267.00 |
- RS庫存編號:
- 282-6743
- 製造零件編號:
- GAP PAD TGP 2000, 16in x 8in x 0.02 sh
- 製造商:
- Bergquist
法例與合規
不適用
- COO (Country of Origin):
- US
產品詳細資訊
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
規格
屬性 | 值 |
---|---|
Dimensions | 16 x 8 x 0.02in |
Thickness | 0.02in |
Length | 16in |
Width | 8in |
Thermal Conductivity | 2W/m·K |
Material | Silicone |
Self-Adhesive | Yes |
Series | TGP 2000 |