Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
- RS庫存編號:
- 127-041
- 製造零件編號:
- HF225FAC-0.004-AC-1112
- 製造商:
- Bergquist
此產品已停售
- RS庫存編號:
- 127-041
- 製造零件編號:
- HF225FAC-0.004-AC-1112
- 製造商:
- Bergquist
產品概覽和技術數據資料表
法例與合規
- COO (Country of Origin):
- US
產品詳細資訊
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm
規格
屬性 | 值 |
|---|---|
| Dimensions | 11 x 12in |
| Thickness | 0.102mm |
| Length | 11in |
| Width | 12in |
| Thermal Conductivity | 1W/m·K |
| Material | Hi-Flow 225F-AC |
| Self-Adhesive | Yes |
| Maximum Operating Temperature | +120°C |
| Material Trade Name | Hi-Flow 225F-AC |
| Operating Temperature Range | Maximum of +120 °C |