STMicroelectronics STEVAL-STWINKT1B Development Kit for STM32L4R9ZI Industrial IoT Applications
- RS庫存編號:
- 210-2301
- 製造零件編號:
- STEVAL-STWINKT1B
- 製造商:
- STMicroelectronics
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- RS庫存編號:
- 210-2301
- 製造零件編號:
- STEVAL-STWINKT1B
- 製造商:
- STMicroelectronics
STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications
The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.
The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring.
The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud dashboard application, all provided to help speed up design cycles for end-to-end solutions.
The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring.
The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud dashboard application, all provided to help speed up design cycles for end-to-end solutions.
The kit supports Bluetooth® low energy wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin expansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The core system board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated with the STM32 family, such as the LTE Cell pack.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and a plastic box.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and a plastic box.
All features
•Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
•Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone
•Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
•Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
•Micro SD Card slot for standalone data logging applications
•On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
•Option to implement Authentication and Brand protection secure solution with STSAFE-A110
•Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone
•Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
•Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
•Micro SD Card slot for standalone data logging applications
•On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
•Option to implement Authentication and Brand protection secure solution with STSAFE-A110
•Wide range of industrial IoT sensors:
ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
ultra-low-power high performance MEMS motion sensor (IIS2DH)
ultra-low-power 3-axis magnetometer (IIS2MDC)
digital absolute pressure sensor (LPS22HH)
low-voltage digital local temperature sensor (STTS751)
industrial grade digital MEMS microphone (IMP34DT05)
analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
•Modular architecture, expandable via on-board connectors:
STMOD+ and 40-pin flex general purpose expansions
12-pin male plug for connectivity expansions
12-pin female plug for sensing expansions
•Other kit components:
Li-Po battery 480 mAh
STLINK-V3MINI debugger with programming cable
Plastic box
ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
ultra-low-power high performance MEMS motion sensor (IIS2DH)
ultra-low-power 3-axis magnetometer (IIS2MDC)
digital absolute pressure sensor (LPS22HH)
low-voltage digital local temperature sensor (STTS751)
industrial grade digital MEMS microphone (IMP34DT05)
analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
•Modular architecture, expandable via on-board connectors:
STMOD+ and 40-pin flex general purpose expansions
12-pin male plug for connectivity expansions
12-pin female plug for sensing expansions
•Other kit components:
Li-Po battery 480 mAh
STLINK-V3MINI debugger with programming cable
Plastic box
屬性 | 值 |
---|---|
Featured Device | STM32L4R9ZI |
For Use With | Industrial IoT Applications |
Kit Classification | Development Kit |
Kit Name | STEVAL-STWINKT1B |