- RS庫存編號:
- 489-6091
- 製造零件編號:
- MBH31001-28W/2.6
- 製造商:
- Malico
53 現貨庫存，可於6工作日發貨。
已增加
單價（不含稅） 個
TWD301.00
(不含稅)
TWD316.05
(含稅)
| 單位 | Per unit |
| 1 - 99 | TWD301.00 |
| 100 - 249 | TWD290.00 |
| 250 - 499 | TWD277.00 |
| 500 + | TWD271.00 |
- RS庫存編號:
- 489-6091
- 製造零件編號:
- MBH31001-28W/2.6
- 製造商:
- Malico
法例與合規
- COO (Country of Origin):
- TW
產品詳細資訊
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
規格
屬性 | 值 |
|---|---|
| For Use With | Clip |
| Length | 31mm |
| Width | 31mm |
| Height | 28mm |
| Dimensions | 31 x 31 x 28mm |
| Mounting | Clip |
| Colour | Black |