Exceptionally low plating load of 4.0pF, ideal for wearables, wireless, and IoT applications Simultaneously optimized for ESR over extended operating temperature range Miniature 1.6 x 1.0 x 0.5 mm SMD package, ideally suited for space constrained designs Available with ±20 ppm set tolerance Seam sealed package for long term reliability Wearables Wireless Modules Internet of Things (IoT) Bluetooth/Bluetooth Low Energy (BLE) Machine-to-Machine (M2M) Connectivity Ultra Low Power MCU Near Field Communication (NFC) ISM Band Applications Ultra low power, energy saving MCU
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