- RS庫存編號:
- 750-0881
- 製造商:
- RS PRO
149 現貨庫存,可於6工作日發貨。
已增加
單價(不含稅) 1 袋 5 套
TWD256.00
(不含稅)
TWD268.80
(含稅)
Bag(s) | Per Bag | Per unit* |
1 - 99 | TWD256.00 | TWD51.20 |
100 - 249 | TWD249.00 | TWD49.80 |
250 - 499 | TWD243.00 | TWD48.60 |
500 + | TWD236.00 | TWD47.20 |
* 參考價格 |
- RS庫存編號:
- 750-0881
- 製造商:
- RS PRO
產品概覽和技術數據資料表
法例與合規
- COO (Country of Origin):
- GB
產品詳細資訊
BGA Heatsink, Standard
Standard type BGA heatsink suitable for a variety of applications.
RS PRO Heatsink - Adhesive Foil, 14 mm x 14 mm x 10 mm
The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.
Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.
Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.
Why Would You Choose This Heatsink?
The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.
Features and Benefits
- BGA heatsink
- Standard, Pushpin
- Made from aluminium
- Adhesive foil mounting
- Anodized finish
- For use with Universal rectangular Alu
- Thermal resistance 10.5° C/W
Dimensions
- 14 mm x 14 mm x 10 mm
Applications
- Integrated Circuits
- PCB
BGA Heatsinks
規格
屬性 | 值 |
---|---|
For Use With | Universal Rectangular Alu |
Length | 14mm |
Width | 14mm |
Height | 10mm |
Dimensions | 14 x 14 x 10mm |
Thermal Resistance | 26.5K/W |
Mounting | Adhesive Foil |
Colour | Black |
Application | Semiconductor Devices |
Material | Aluminium |
Package Type | BGA |
Finish | Anodized |