onsemi, ArrayJ-60035-4P-BGA 4-Element Photomultiplier, 420nm, Surface Mount BGA package

ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been used to create high fill-factor, scalable arrays. The TSV-packaged sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3 mm, 4 mm or 6 mm pixels. The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well.

High fill-factor, scalable arrays
Variety of formats ranging from 2´2 to 8´8
Minimal deadspace, with fill factors of >90%
Each array as either a multi-way connector or BGA on the reverse for access to all signals
The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
The pixel-level performance is exactly as per that of the individual J-Series sensors
Optional evaluation boards are available for easy access to signals
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics

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