Heatsink, 11K/W, 40 x 40 x 24mm, Adhesive Foil
- RS庫存編號:
- 750-0853
- 製造零件編號:
- BGA FC 015
- 製造商:
- ABL Components
此產品已停售
- RS庫存編號:
- 750-0853
- 製造零件編號:
- BGA FC 015
- 製造商:
- ABL Components
產品概覽和技術數據資料表
法例與合規
- COO (Country of Origin):
- GB
產品詳細資訊
BGA Heatsink, Flip Chip
Flip chip type BGA heatsink suitable for high-power LED package cooling and various other applications.
BGA Heatsinks
規格
屬性 | 值 |
|---|---|
| Length | 40mm |
| Width | 40mm |
| Height | 24mm |
| Dimensions | 40 x 40 x 24mm |
| Thermal Resistance | 11K/W |
| Mounting | Adhesive Foil |
| Colour | Black |
| Package Type | BGA |