Heatsink, Universal Square Alu, 27.4K/W, 14 x 14 x 10mm, Adhesive Foil, Conductive Foil
- RS庫存編號:
- 674-4756
- 製造零件編號:
- ICK BGA 14x14x10
- 製造商:
- Fischer Elektronik
25 在6 工作日內發貨 (海外庫存)
278 在6 工作日內發貨 (海外庫存)
已增加
單價（不含稅） 個
TWD82.00
(不含稅)
TWD86.10
(含稅)
| 單位 | Per unit |
| 1 - 49 | TWD82.00 |
| 50 - 99 | TWD79.00 |
| 100 - 249 | TWD75.00 |
| 250 + | TWD74.00 |
- RS庫存編號:
- 674-4756
- 製造零件編號:
- ICK BGA 14x14x10
- 製造商:
- Fischer Elektronik
產品概覽和技術數據資料表
法例與合規
- COO (Country of Origin):
- DE
產品詳細資訊
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
規格
屬性 | 值 |
|---|---|
| For Use With | BGA |
| Length | 14mm |
| Width | 14mm |
| Height | 10mm |
| Dimensions | 14 x 14 x 10mm |
| Thermal Resistance | 27.4K/W |
| Mounting | Adhesive Foil, Conductive Foil |
| Colour | Black |
| Package Type | BGA |
| Material | Aluminium |